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論文標題
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Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper
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內容摘要
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Grain boundaries affect the migration of atoms and electrons in polycrystalline
solids, thus influencing many of the mechanical and electrical properties. By introducing
nanometer-scale twin defects into copper grains, we show that we can change the
grain-boundary structure and atomic-diffusion behavior along the boundary. Using
in situ ultrahigh-vacuum and high-resolution transmission electron microscopy, we
observed electromigration-induced atomic diffusion in the twin-modified grain boundaries.
The triple point where a twin boundary meets a grain boundary was found to slow
down grain-boundary and surface electromigration by one order of magnitude. We propose
that this occurs because of the incubation time of nucleation of a new step at the
triple points. The long incubation time slows down the overall rate of atomic transport.
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期刊名稱
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Science 22 August 2008: Vol. 321. no. 5892, pp. 1066 - 1069
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主要作者
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廖建能教授
陳冠嘉博士
吳文偉助理教授
陳力俊副主委
杜經寧院士
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